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FGG.1B.310.CLAD52Z

  • FGG.1B.310.CLAD52Z
  • FGG.1B.310.CLAD52Z

FGG.1B.310.CLAD52Z

FGG.1B.310.CLAD52Z

LEMO

Plug, Male Pins Brass Free Hanging (In-Line) 10 Positions Solder Cup Gold Chrome Bulk G Push-Pull

SOT-23

FGG.1B.310.CLAD52Z Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 12 Weeks
Contact Material NOT SPECIFIED
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Shell Material Brass
Insert Material Polyetheretherketone (PEEK)
Backshell Material, Plating Brass, Chrome
Operating Temperature -55°C~250°C
Packaging Bulk
Series 1B
Feature Backshell
Pbfree Code yes
Part Status Active
Moisture Sensitivity Level (MSL) Not Applicable
Termination Solder Cup
ECCN Code EAR99
Connector Type Plug, Male Pins
Number of Positions 10
Color Silver
Gender Male
HTS Code 8536.69.40.20
Fastening Type Push-Pull
Contact Finish - Mating Gold
Orientation G
Shielding Shielded
Ingress Protection IP50 - Dust Protected
Current Rating 2.5A
Shell Finish Chrome
Shell Size - Insert 310
Contact Style Pin
Cable Opening 0.165 ~ 0.205 (4.20mm ~ 5.20mm)
Diameter 12mm
Length 43mm
Contact Finish Thickness - Mating 39.4μin 1.00μm
Material Flammability Rating UL94 V-0
RoHS Status ROHS3 Compliant
Ratings IP50
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $52.07000 $52.07
500 $51.5493 $25774.65
1000 $51.0286 $51028.6
1500 $50.5079 $75761.85
2000 $49.9872 $99974.4
2500 $49.4665 $123666.25
FGG.1B.310.CLAD52Z Product Details

FGG.1B.310.CLAD52Z Overview


Packaging for this item is Plug, Male Pins.There is a mounting type of Free Hanging (In-Line) for this device.It is necessary to use a Bulk case for packaging the product.This product is part of the 1B Series.In many ways, its Backshell feature makes it more powerful.Free Hanging is used to mount the part.In this case, the device operates at -55°C~250°C Operating Temperature.

FGG.1B.310.CLAD52Z Features


1B series


FGG.1B.310.CLAD52Z Applications


There are a lot of LEMO
FGG.1B.310.CLAD52Z Circular Connectors applications.


  • Transportation
  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications

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