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FGG.1K.306.CLAC55Z

  • FGG.1K.306.CLAC55Z
  • FGG.1K.306.CLAC55Z

FGG.1K.306.CLAC55Z

FGG.1K.306.CLAC55Z

LEMO

Plug, Male Pins Brass Free Hanging (In-Line) 6 Positions Solder Cup Gold Chrome Bulk G Push-Pull

SOT-23

FGG.1K.306.CLAC55Z Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Contact Material NOT SPECIFIED
Mount Free Hanging
Mounting Type Free Hanging (In-Line)
Shell Material Brass
Insert Material Polyetheretherketone (PEEK)
Backshell Material, Plating Brass, Chrome
Operating Temperature -55°C~200°C
Packaging Bulk
Series 1K
Feature Backshell
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Termination Solder Cup
Connector Type Plug, Male Pins
Number of Positions 6
Color Silver
Gender Male
Fastening Type Push-Pull
Contact Finish - Mating Gold
Orientation G
Shielding Shielded
Ingress Protection IP66/68 - Dust Tight, Water Resistant, Waterproof
Current Rating 7A
Shell Finish Chrome
Shell Size - Insert 306
Contact Resistance 3.6mOhm
Cable Opening 0.201 ~ 0.217 (5.10mm ~ 5.50mm)
Contact Finish Thickness - Mating 39.4μin 1.00μm
Material Flammability Rating UL94 V-0
REACH SVHC No SVHC
RoHS Status ROHS3 Compliant
Ratings Dust Tight, IP66, Water Resistant, Waterproof
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $51.94000 $51.94
500 $51.4206 $25710.3
1000 $50.9012 $50901.2
1500 $50.3818 $75572.7
2000 $49.8624 $99724.8
2500 $49.343 $123357.5
FGG.1K.306.CLAC55Z Product Details

FGG.1K.306.CLAC55Z Overview


Packaging for this item is Plug, Male Pins.There is a mounting type of Free Hanging (In-Line) for this device.It is necessary to use a Bulk case for packaging the product.This product is part of the 1K Series.In many ways, its Backshell feature makes it more powerful.Free Hanging is used to mount the part.In this case, the device operates at -55°C~200°C Operating Temperature.

FGG.1K.306.CLAC55Z Features


1K series


FGG.1K.306.CLAC55Z Applications


There are a lot of LEMO
FGG.1K.306.CLAC55Z Circular Connectors applications.


  • Transportation
  • Embedded systems
  • Datacom
  • Communication
  • Medical technology
  • Military Technology
  • Measuring & Control Technology
  • Instrumentation
  • Automotive Electronics
  • Telecommunications

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