10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
Number of Pins
10
Operating Temperature
-40°C~125°C
Packaging
Tube
Published
2010
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Max Power Dissipation
1.8mW
Base Part Number
LTC2634
Pin Count
10
Output Type
Voltage - Buffered
Interface
SPI, Serial
Number of Bits
8
Supply Type
Single
Reference Type
External, Internal
Data Interface
SPI
Differential Output
No
Voltage - Supply, Analog
5V
Settling Time
3.8μs (Typ)
INL/DNL (LSB)
±0.05, ±0.5 (Max)
Number of D/A Converters
4
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
250
$3.11220
$778.05
LTC2634HMSE-HMI8#PBF Product Details
LTC2634HMSE-HMI8#PBF Overview
The package that contains this software is called 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad. FPGA modules can be attached to development boards using a Surface Mount-connector. It is recommended that the operating temperature be kept within the range -40°C~125°C while the machine is operating. It is designed to maximiTubee space efficiency by containing the FPGA model in Tube. If you are looking for related parts, you can use the base part number LTC2634 as a starting point. In this case, 10 pins are used in the design. In my opinion, this FPGA could produce fantastic results if mounted in Surface Mount, provided that its specifications are followed. A total of 10 pins are included in this device.