10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
Number of Pins
10
Operating Temperature
-40°C~125°C
Packaging
Tube
Published
2010
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Max Power Dissipation
1.8mW
Base Part Number
LTC2634
Pin Count
10
Output Type
Voltage - Buffered
Interface
SPI, Serial
Number of Bits
8
Supply Type
Single
Reference Type
External, Internal
Data Interface
SPI
Differential Output
No
Voltage - Supply, Analog
5V
Settling Time
3.8μs (Typ)
INL/DNL (LSB)
±0.05, ±0.5 (Max)
Number of D/A Converters
4
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
250
$3.11220
$778.05
LTC2634HMSE-HMX8#PBF Product Details
LTC2634HMSE-HMX8#PBF Overview
There are two packages that contain it: 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad package and X package. An attachment Surface Mount allows the FPGA module to be attached to the development board. When operating the machine, it is important to keep the temperature within -40°C~125°C range. There is an FPGA model contained in Tube in order to conserve space. In order to find related parts, use the part number LTC2634 as a base. In this case, there are 10 pins on the board. Having stated that, if this FPGA is mounted in Surface Mount, then it may be able to perform fantastically according to its specifications. This device has a pin count of 10 in it.