LTC2865HDE#PBF Overview

The enhanced 12-WFDFN Exposed Pad package makes it an excellent LED driver.In this package, the receiver is mounted in the Tube format.Several solutions have used this Transceiver can transceiver in a variety of applications due to its Transceiver IC nature.PCB or development board with Surface Mount-type connectors can accommodate this wide receiver.A differential driver like this uses 3V~5.5V of power.The field can have up to 1/1 eligible receivers/drivers at once when using this electronic part.IC receiver likes this one are designed for use in applications where operating temperatures are -40°C~125°C.Driver ICs in this category can operate efficiently with a supply voltage range of 3.3V.In order to drive and receive signals from data, this wide receiver has 12 terminations integrated.The pinouts for this transceiver are standardized to meet the needs of the market.Since the base part number LTC2865 uniquely identifies the product type, temperature, package, etc., you can use it to find more variations.12-pin driver IC with improved power dissipation control.It provided a 1-bit resolution capability with this ic receiver.This receiver is typically specified with a resolution of 1 bits. This transceiver module is designed to operate from an input voltage supply of 5V.A rf transceiver module named Line Driver or Receivers belongs to this subcategory.An 8-pin power supply is provided by this driver IC, which allows it to operate from an 3.3V-pin power supply.In total, there are 1 transceivers implemented by this module isolated transceiver.

LTC2865HDE#PBF Features

Tube package
12 pin count
12 pins
3.3V power supply

LTC2865HDE#PBF Applications

There are a lot of Linear Technology/Analog Devices LTC2865HDE#PBF Drivers/Receivers/Transceivers applications.

• Fiber optic cable connection network
• LAN, SAN, WAN (local, storage, work area networks)
• Data center
• Wireless HD Photography
• Bridges
• Thermal management
• Home theater wiring-free
• Wireless access points
• Wireless showroom
• Structural bonding