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73M1906B-IVT/F

73M1906B-IVT/F

73M1906B-IVT/F

Maxim Integrated

73M1906 Telecom device1 CircuitsMin 3V VMax 3.6V V

SOT-23

73M1906B-IVT/F Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 6 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 20-TSSOP (0.173, 4.40mm Width)
Supplier Device Package 20-TSSOP
Operating Temperature -40°C~85°C
Packaging Tube
Published 2010
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Voltage - Supply 3V~3.6V
Base Part Number 73M1906
Function Direct Access Arrangement (DAA)
Interface PCM
Number of Circuits 1
Max Supply Voltage 3.6V
Min Supply Voltage 3V
Data Rate 1.536 Mbps
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $1.50000 $1.5
500 $1.485 $742.5
1000 $1.47 $1470
1500 $1.455 $2182.5
2000 $1.44 $2880
2500 $1.425 $3562.5
73M1906B-IVT/F Product Details

73M1906B-IVT/F Overview


Saving board space is achieved with the 20-TSSOP (0.173, 4.40mm Width) package.Telecommunications equipment is packed according to Tube's method.A Surface Mount mounting type is used.The telecom IC is composed of 1 circuits.Improved efficiency can be ensured when the supply voltage of 3V~3.6V is provided.Using -40°C~85°C as the operating temperature can result in reliable performance.Mounted in the direction of Surface Mount.73M1906 is the base part number, which can be used to find more related parts.Ensure normal operation by setting the temperature to -40°C minimum.The temperature is set at the maximum value of 85°C to ensure normal operation.A voltage of at least 3V should be supplied.If the voltage supplied is lower than 3.6V, telecommunications device should be used.

73M1906B-IVT/F Features


Available in the 20-TSSOP (0.173, 4.40mm Width) package

73M1906B-IVT/F Applications


There are a lot of Maxim Integrated 73M1906B-IVT/F Telecom applications.

  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • Channel Banks
  • PBXs channel bank
  • Dual battery supply voltage SLICs
  • Add/Drop multiplexers (ADMs)
  • BITS Timing
  • Interfaces to E3
  • Fractional T1/E1/J1
  • E3/DS3 Access Equipment

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