DS3170N+T&R Overview

Board space can be saved by using the 100-LBGA, CSBGA package.For telecommunications equipment packing, the Tape & Reel (TR) method is used.Telecommunications equipment is mounted with type Surface Mount.A 1-circuit composes this telecom IC .Telecom circuit is possible to increase efficiency by providing 3.135V~3.465V with a higher voltage.-40°C~85°C is a temperature setting that is reliable when telecom switching comes to performance.DS3170 can be used to locate related parts based on telecom switching's base part number.A 120mA-volt supply current is used to operate telecom equipment .

DS3170N+T&R Features

Available in the 100-LBGA, CSBGA package

DS3170N+T&R Applications

There are a lot of Maxim Integrated DS3170N+T&R Telecom applications.

• Interfaces to E3
• ISDN terminal adapter
• Multiplexers
• Digital subscriber line access multiplexer (DSLAM)
• CSU/DSU E1/T1/J1 Interface
• T1/E1/J1 Multiplexer and Channel Banks
• Routers
• Fiber
• Digital Cross-connect Systems (DCS)
• Wireless Local Loop