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DS4560LS-LO+

DS4560LS-LO+

DS4560LS-LO+

Maxim Integrated

Tube Obsolete Surface Mount Hot Swap Controllers 1.1mA mA Latched Fault, OVP, Thermal Limit UVLO 8-SOIC (0.154, 3.90mm Width) General Purpose Hot Swap Controller

SOT-23

DS4560LS-LO+ Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Operating Temperature -40°C~135°C
Packaging Tube
Published 2009
Feature Latched Fault, OVP, Thermal Limit UVLO
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Hot Swap Controller
Applications General Purpose
Voltage - Supply 9V~13.2V
Base Part Number DS4560
Number of Outputs 1
Current - Output (Max) 4A
Current - Supply 1.1mA
Internal Switch(s) Yes
Programmable Features Circuit Breaker, Current Limit, Slew Rate
Feature Pins ILIM, TIMER, VRAMP
Radiation Hardening No
RoHS Status ROHS3 Compliant
DS4560LS-LO+ Product Details

DS4560LS-LO+ Overview


There is a 8-SOIC (0.154, 3.90mm Width) package that includes this.The package resembles a Tube.This is set up in the same way as Surface Mount.Hot-swappable device is classified as a Hot Swap Controller electrical component.A temperature setting of -40°C~135°C will ensure reliable operation.General Purpose applications can be downloaded from the device.The article is featured in Latched Fault, OVP, Thermal Limit UVLO.Hot-swappable device should be able to work wHot-swappable deviceh a 9V~13.2VV power source.Numbers in the DS4560 family include it.Among its programmable features are Circuit Breaker, Current Limit, Slew Rate.There is currently an adequate supply of 1.1mA.Surface Mount directs its position.By default, it produces output 1.There is a maximum output of 4AV from the device.

DS4560LS-LO+ Features


Features of Latched Fault, OVP, Thermal Limit UVLO
Programmable features of Circuit Breaker, Current Limit, Slew Rate


DS4560LS-LO+ Applications


There are a lot of Maxim Integrated
DS4560LS-LO+ hot swap controllers applications.


  • Datacom
  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes
  • Backplane
  • Loads

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