MAX3222ECUP+T Overview

LED drivers benefit from this IC's enhanced 20-TSSOP (0.173, 4.40mm Width) package.The package of this receiver is Tape & Reel (TR).Being a Transceiver can transceiver, this part has empowered many solutions to serve for a variety of applications.Any Surface Mount-type PCB or development board can be used with this wide receiver.A differential driver like this uses 3V~5.5V of power.At any one time, this electronic part can have up to 2/2 eligible receivers/drivers.IC receiver is designed for applications with a temperature of 0°C~70°C.With a supply voltage range of 3.3V, this line driver ic operates efficiently.This integrated circuit has 20 terminations designed for driving and receiving signals from data.There are 20 pinouts available on this transceiver which are market standard.Since the base part number MAX3222 describes the product type, temperature, package, etc., you might get more options by searching with it.An enhanced power dissipation control is provided by this 20-pin driver IC.Package size is drastically reduced by downsizing ICs and mounting them in high-density Surface Mount arrays.As a rule of thumb, this receiver is typically specified with a resolution of 2 bits.As mentioned above, the transceiver module is designed to operate from an input voltage supply of 5.5V.A subcategory named Line Driver or Receivers can be used to group this rf transceiver module.There is one driver IC that is designed to operate from a 3.3/5V power supply, and only one driver IC in total.There are 1 transceivers in total that this module isolated transceiver implements.On the integrator circuit are embedded 2 drivers.It is an integrated circuit with 8 serial I/Os that are in line with industry standards.

MAX3222ECUP+T Features

Tape & Reel (TR) package
20 pin count
20 pins
3.3/5V power supply

MAX3222ECUP+T Applications

There are a lot of Maxim Integrated MAX3222ECUP+T Drivers/Receivers/Transceivers applications.

• Switching system
• Gigabit Ethernet
• 1x/2x Fiber Channel
• Aircraft navigation
• Structural bonding
• Wireless network systems
• Mainframes, workstations or storage devices
• Telecom applications
• Laser diode bonding
• Aircraft positioning