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MAX501AEWG

MAX501AEWG

MAX501AEWG

Maxim Integrated

DAC Voltage - Buffered Surface Mount R-2R R 7.5mm mm

SOT-23

MAX501AEWG Datasheet

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In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 24-SOIC (0.295, 7.50mm Width)
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tube
Published 1997
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 24
Subcategory Other Converters
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 245
Number of Functions 1
Supply Voltage 15V
Base Part Number MAX501
Pin Count 24
JESD-30 Code R-PDSO-G24
Output Type Voltage - Buffered
Number of Bits 12
Architecture R-2R
Converter Type D/A CONVERTER
Reference Type External
Data Interface Parallel
Differential Output No
Voltage - Supply, Analog ±11.4V~15.75V
Settling Time 5μs
Linearity Error-Max (EL) 0.0732%
Input Bit Code BINARY, OFFSET BINARY
INL/DNL (LSB) ±0.75 (Max), ±1 (Max)
Negative Supply Voltage-Nom -15V
Number of D/A Converters 1
Height Seated (Max) 2.65mm
Width 7.5mm
RoHS Status Non-RoHS Compliant
MAX501AEWG Product Details

MAX501AEWG Overview


A 24-SOIC (0.295, 7.50mm Width) package is provided with this component. An electrical supply voltage of 15V powers it. A Other Converters-series FPGA part. An FPGA module can be attached to a development board with a Surface Mount-pin. During the operation of the system, the operating temperature should remain within the range of -40°C~85°C. It is for space saving reasons that this FPGA model is contained in Tube. As a whole, it has 24 terminations. Related parts can be found by using its base part number MAX501. In addition to this, it has 24 pins.

MAX501AEWG Features


24-SOIC (0.295, 7.50mm Width) package
24 pin count


MAX501AEWG Applications


There are a lot of Maxim Integrated
MAX501AEWG Digital to Analog Converters (DAC) applications.


  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications

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