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MAX5112GTJ+T

MAX5112GTJ+T

MAX5112GTJ+T

Maxim Integrated

DACCurrent - BufferedSurface Mount 1.75 B B

SOT-23

MAX5112GTJ+T Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 19 Weeks
Mounting Type Surface Mount
Package / Case 32-WFQFN Exposed Pad
Number of Pins 32
Operating Temperature -40°C~105°C
Packaging Tape & Reel (TR)
Published 2014
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Base Part Number MAX5112
Output Type Current - Buffered
Number of Bits 14
Reference Type Internal
Data Interface I2C
Differential Output No
Resolution 1.75 B
Voltage - Supply, Analog 2.6V~3.3V -5V
Voltage - Supply, Digital 2.6V~3.3V
Settling Time 15μs (Typ)
Integral Nonlinearity (INL) 8 LSB
INL/DNL (LSB) ±2, ±0.5
Number of D/A Converters 9
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
2,500 $26.28000 $52.56
MAX5112GTJ+T Product Details

MAX5112GTJ+T Overview


A 32-WFQFN Exposed Pad package is provided with this component. Using a Surface Mount connector, you can mount this FPGA module on the development board. It is recommended that the operating temperature be kept within the range -40°C~105°C while the machine is operating. This FPGA model is contained in Tape & Reel (TR) for space saving. For related parts, use its base part number MAX5112. 32 pins are designed into the device.

MAX5112GTJ+T Features


32-WFQFN Exposed Pad package
32 pins

MAX5112GTJ+T Applications


There are a lot of Maxim Integrated MAX5112GTJ+T Digital to Analog Converters (DAC)?applications.

  • Bus Structured instruments
  • Waveform Reconstruction
  • Microprocessor Controlled Circuits
  • Calibration
  • Digitally controlled calibration
  • Precision setpoint control
  • Precision AGC Circuits
  • Automated Test Equipment
  • LMDS/MMDS, point-to-point
  • Optical Networks

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