DAC Voltage - Buffered Surface Mount Current Source R 4mm mm
SOT-23
MAX5520ETC+T Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
6 Weeks
Mounting Type
Surface Mount
Package / Case
12-WQFN Exposed Pad
Surface Mount
YES
Operating Temperature
-40°C~85°C
Packaging
Tape & Reel (TR)
Published
2004
JESD-609 Code
e3
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
12
Terminal Finish
MATTE TIN
Technology
BICMOS
Terminal Position
QUAD
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Supply Voltage
5V
Terminal Pitch
0.8mm
Base Part Number
MAX5520
Pin Count
12
Output Type
Voltage - Buffered
Number of Bits
10
Architecture
Current Source
Converter Type
D/A CONVERTER
Reference Type
External
Data Interface
SPI
Differential Output
No
Voltage - Supply, Analog
1.8V~5.5V
Voltage - Supply, Digital
1.8V~5.5V
Settling Time
660μs (Typ)
Linearity Error-Max (EL)
0.3906%
Input Bit Code
BINARY
INL/DNL (LSB)
±1, ±0.2
Input Format
SERIAL
Number of D/A Converters
1
Height Seated (Max)
0.8mm
Length
4mm
Width
4mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
2,500
$2.65200
$5.304
MAX5520ETC+T Product Details
MAX5520ETC+T Overview
A 12-WQFN Exposed Pad package contains it, and it is available for download. Power is provided by a 5V-volt supply. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Operating temperatures should be maintained within the -40°C~85°C range at all times when the unit is in use. A model of this FPGA is contained in Tape & Reel (TR) for the purpose of saving space. In total, there are a total of 12 terminations on it. For related parts, use its base part number MAX5520. Featuring 12 pins in total, it is a versatile device.
MAX5520ETC+T Features
12-WQFN Exposed Pad package 12 pin count
MAX5520ETC+T Applications
There are a lot of Maxim Integrated MAX5520ETC+T Digital to Analog Converters (DAC) applications.
Software Radio
Wireless infrastructure:
WCDMA, CDMA2000, TD-SCDMA, WiMAX
Wideband communications:
LMDS/MMDS, point-to-point
Instrumentation:
RF signal generators, arbitrary waveform generators