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MAX5631UTK+T

MAX5631UTK+T

MAX5631UTK+T

Maxim Integrated

DAC Voltage 2 B B

SOT-23

MAX5631UTK+T Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Package / Case QFN
Surface MountYES
Number of Pins 16
PackagingTape & Reel
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 68
Terminal Finish Matte Tin (Sn)
Max Operating Temperature85°C
Min Operating Temperature 0°C
Subcategory Other Converters
Technology BICMOS
Terminal Position QUAD
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Supply Voltage 10V
Terminal Pitch0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Pin Count68
JESD-30 Code S-XQCC-N68
Output Type Voltage
Temperature GradeCOMMERCIAL EXTENDED
Number of Bits 16
Converter Type D/A CONVERTER
Resolution 2 B
Input Bit Code BINARY
Negative Supply Voltage-Nom -4V
Input Format SERIAL
Analog Output Voltage-Max 9.2V
Number of DAC Channels1
Analog Output Voltage-Min -4.5V
Height Seated (Max) 0.8mm
Radiation HardeningNo
RoHS StatusRoHS Compliant
In-Stock:4401 items

MAX5631UTK+T Product Details

MAX5631UTK+T Overview


In the QFN package, you will find it. In order to operate it, a voltage supply of 10V volts is required. FPGA parts like this belong to the Other Converters family. Unlike other FPGA models, this one is contained in Tape & Reel for the sake of space saving. 68 terminations are present in total. In order to make it work, 16 pins have been designed. As a result of the design of this module, the maximum operating temperature reaches 85°C. There should be a temperature difference between 0°C and the operating temperature. With a total of 68 pins, it is equipped with a high level of security.

MAX5631UTK+T Features


QFN package
68 pin count
16 pins


MAX5631UTK+T Applications


There are a lot of Maxim Integrated
MAX5631UTK+T Digital to Analog Converters (DAC) applications.


  • Data Acquisition Systems
  • Calibration
  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point

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