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MAX5802BATB+T

MAX5802BATB+T

MAX5802BATB+T

Maxim Integrated

DACVoltage - BufferedSurface Mount R-2R R1.5 B B

SOT-23

MAX5802BATB+T Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 18 Weeks
Mounting Type Surface Mount
Package / Case 10-WFDFN Exposed Pad
Surface Mount YES
Number of Pins 10
Operating Temperature -40°C~125°C
Packaging Tape & Reel (TR)
Published 2014
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 10
Subcategory Other Converters
Technology BICMOS
Terminal Position DUAL
Number of Functions 2
Terminal Pitch 0.5mm
Output Type Voltage - Buffered
Power Supplies 3/5V
Number of Bits 12
Supply Current-Max 0.9mA
Architecture R-2R
Converter Type D/A CONVERTER
Reference Type External, Internal
Data Interface I2C
Differential Output No
Resolution 1.5 B
Voltage - Supply, Analog 2.7V~5.5V
Voltage - Supply, Digital 2.7V~5.5V
Settling Time 4.5μs (Typ)
Integral Nonlinearity (INL) 1 LSB
INL/DNL (LSB) ±0.5, ±0.2
Number of D/A Converters 2
RoHS Status ROHS3 Compliant
MAX5802BATB+T Product Details

MAX5802BATB+T Overview


The package that contains this software is called 10-WFDFN Exposed Pad. An FPGA part from the Other Converters family. An attachment Surface Mount allows the FPGA module to be attached to the development board. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~125°C at all times. There is an FPGA model contained in Tape & Reel (TR) in order to conserve space. There are a total of 10 terminations. In this case, there are 10 pins on the board. There is a 3/5V power supply that is required to operate it.

MAX5802BATB+T Features


10-WFDFN Exposed Pad package
10 pins

MAX5802BATB+T Applications


There are a lot of Maxim Integrated MAX5802BATB+T Digital to Analog Converters (DAC)?applications.

  • General Purpose Trimming Adjustments
  • Automatic Test Equipment
  • Gain and offset adjustment
  • Data Distribution System
  • Digital Offset & Gain Adjustment
  • High-End Compact Disc Players
  • Bus Structured instruments
  • Waveform Reconstruction
  • Closed-loop process control
  • Precision setpoint control

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