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MX7533LEWE+

MX7533LEWE+

MX7533LEWE+

Maxim Integrated

DAC 1.25 B B

SOT-23

MX7533LEWE+ Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case SOIC
Number of Pins 16
Packaging Bulk
Pbfree Code yes
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Pin Count 16
Interface Parallel
Max Supply Voltage 16.5V
Min Supply Voltage 5V
Power Dissipation-Max 450mW
Number of Bits 10
Supply Type Single
Resolution 1.25 B
Settling Time 600 ns
Number of Converters 1
RoHS Status RoHS Compliant
Lead Free Lead Free
MX7533LEWE+ Product Details

MX7533LEWE+ Overview


A SOIC package is provided with this component. It is for space saving reasons that this FPGA model is contained in Bulk. 16 pins are designed into the device. As long as this FPGA is mounted in Surface Mount, it should be able to function as it should in terms of its specifications, as well as its capabilities. As far as the maximum operating temperature of this module is concerned, it reaches 85°C. Operating temperatures should exceed -40°C. In addition to this, it has 16 pins. A maximum voltage of 16.5V can be supplied to it. As long as the supply voltage is at least 5V, it is able to work properly.

MX7533LEWE+ Features


SOIC package
16 pin count
16 pins


MX7533LEWE+ Applications


There are a lot of Maxim Integrated
MX7533LEWE+ Digital to Analog Converters (DAC) applications.


  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications

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