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MX7537KCWG+

MX7537KCWG+

MX7537KCWG+

Maxim Integrated

DAC 1.5 B B 7.5mm mm

SOT-23

MX7537KCWG+ Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Package / Case SOIC
Number of Pins 24
JESD-609 Code e3
Pbfree Code yes
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 24
ECCN Code 3A001.A.5.B
Terminal Finish Matte Tin (Sn)
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Subcategory Other Converters
Technology CMOS
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 2
Supply Voltage 15V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Pin Count 24
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Interface Parallel
Max Supply Voltage 16.5V
Min Supply Voltage 10.8V
Power Dissipation-Max 450mW
Number of Bits 12
Converter Type D/A CONVERTER
Supply Type Single
Resolution 1.5 B
Settling Time 1.5 μs
Integral Nonlinearity (INL) 0.5 LSB
Number of Converters 2
Length 15.4mm
Width 7.5mm
RoHS Status RoHS Compliant
Lead Free Lead Free
MX7537KCWG+ Product Details

MX7537KCWG+ Overview


In the package SOIC, this product is provided. Supply voltage is 15V volts. There is a Other Converters family component in this FPGA part. In total, the terminations of this piece are 24. The device has 24 pins which are included in the design. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. This module can reach a maximum operating temperature of 70°C when operating at its maximum power. It is necessary to maintain an operating temperature higher than 0°C. I am going to present you with a device that is equipped with 24 pins. The maximum supply voltage it can take is 16.5V. The device can function at a minimum voltage of 10.8V.

MX7537KCWG+ Features


SOIC package
24 pin count
24 pins


MX7537KCWG+ Applications


There are a lot of Maxim Integrated
MX7537KCWG+ Digital to Analog Converters (DAC) applications.


  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications
  • Process Control and Industrial Automation
  • Automatic Test Equipment
  • Portable Equipment

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