XRT72L71IQ Overview

A 272-BBGA package is used to reduce board space requirements.A Tray-packing method is used to pack telecommunications equipment.Telecommunications equipment is mounted with type Surface Mount.Providing 3.3V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.Telecom switching is possible to achieve reliable performance when the operating temperature is set at -40°C~85°C.The current supply is 190mA.

XRT72L71IQ Features

Available in the 272-BBGA package

XRT72L71IQ Applications

There are a lot of MaxLinear, Inc. XRT72L71IQ Telecom applications.

• Digital subscriber line access multiplexer (DSLAM)
• Network Multiplexing and Terminating Equipment
• High-Density T1/E1/J1 interfaces for Multiplexers
• T1 Rates PCM Line Interface
• Digital cross connects (DSX-1)
• SDH/SONET multiplexers
• Channel Service Units (CSUs): T1/E1/J1
• CSU/DSU Equipment
• Home Side Box
• Cable Modem