XRT73L04BIV Overview

Space is saved on the board by using the 144-LQFP package.A Tray-packing method is used to pack telecommunications equipment.A Surface Mount-mount is used for mounting the telecom circuit.There are 4 circuits in this telecom IC .Providing 3.135V~3.465V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.-40°C~85°C is the operating temperature that can be set for reliable performance.The current supply is 500mA.

XRT73L04BIV Features

Available in the 144-LQFP package

XRT73L04BIV Applications

There are a lot of MaxLinear, Inc. XRT73L04BIV Telecom applications.

• DECT (Digital European Cordless Telephone) Base
• Fiber to the Home (FTTH)
• Remote wireless modules
• Digital cross connects (DSX-1)
• NIU
• Channel Service Units (CSUs): T1/E1/J1
• Digital Cross-connect Systems (DCS)
• Wireless local loop (WLL)
• Switching Systems
• T1/E1/J1 Performance Monitoring