XRT73L06IB Overview

A 217-BBGA package is used to reduce board space requirements.The way of Tray is employed for telecommunications equipment packing.There is a type Surface Mount mount for this telecom circuit.This telecom IC is composed of 6 circuits.3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Telecom switching is possible to achieve reliable performance when the operating temperature is set at -40°C~85°C.

XRT73L06IB Features

Available in the 217-BBGA package

XRT73L06IB Applications

There are a lot of MaxLinear, Inc. XRT73L06IB Telecom applications.

• Multi-Line E1 Interface Cards
• Network Multiplexing and Terminating Equipment
• Hybrid fiber coax (HFC)
• Digital subscriber line access multiplexer (DSLAM)
• SDH Multiplexers
• Multiplexers
• E1 Rates PCM Line Interface
• Channel Banks
• T3 channelized access concentrators
• Remote wireless modules