XRT73L06IB-F Overview

Space is saved on the board by using the 217-BBGA package.A Tray-packing method is used to pack telecommunications equipment.In this case, Surface Mount is the mounting type.A 6-circuit composes this telecom IC .Providing 3.135V~3.465V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.Operating temperatures of -40°C~85°C can ensure reliable performance.

XRT73L06IB-F Features

Available in the 217-BBGA package

XRT73L06IB-F Applications

There are a lot of MaxLinear, Inc. XRT73L06IB-F Telecom applications.

• Integrated Multi-Service Access Platforms (IMAPs)
• Codec function on telephone switch line cards
• Interfaces to DS3
• PBX (Private Branch Exchange)
• Fiber
• T2 Rates PCM Line Interface
• Digital Cross-Connect Systems
• Cable Telephony
• ATM equipment with integrated DS1 interfaces
• Digital Cross Connect Systems