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XRT75L00DIV

XRT75L00DIV

XRT75L00DIV

MaxLinear, Inc.

Telecom device1 Circuits

SOT-23

XRT75L00DIV Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 52-LQFP
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 1
Current - Supply 150mA
XRT75L00DIV Product Details

XRT75L00DIV Overview


A 52-LQFP package is used to reduce board space requirements.For packing, Tray is used.Telecommunications equipment is mounted with type Surface Mount.1 circuits are used in this telecom IC .Providing 3.135V~3.465V wtelecom IC's efficiencyh the correct supply voltage will improve efficiency.Using -40°C~85°C as the operating temperature can result in reliable performance.150mA is the supply current.

XRT75L00DIV Features


Available in the 52-LQFP package

XRT75L00DIV Applications


There are a lot of MaxLinear, Inc. XRT75L00DIV Telecom applications.

  • DECT (Digital European Cordless Telephone) Base
  • Set-Top Box
  • Short/Medium Loop
  • Public switching systems
  • Interfaces to DS3
  • PCM channel bank
  • T3 channelized access concentrators
  • Fiber Optic Terminals
  • T2 Rates PCM Line Interface
  • Home Gateway

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