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XRT75L00DIV-F

XRT75L00DIV-F

XRT75L00DIV-F

MaxLinear, Inc.

Telecom device1 Circuits

SOT-23

XRT75L00DIV-F Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 52-LQFP
Supplier Device Package 52-TQFP (10x10)
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 1
Current - Supply 150mA
XRT75L00DIV-F Product Details

XRT75L00DIV-F Overview


A 52-LQFP package saves space on a board.Telecommunications equipment is packed according to Tray's method.A Surface Mount mounting type is used.There are 1 circuits in this telecom IC .A higher supply voltage for 3.135V~3.465V will improve efficiency.At -40°C~85°C, reliable performance can be achieved.A current of 150mA is used as the supply current.

XRT75L00DIV-F Features


Available in the 52-LQFP package

XRT75L00DIV-F Applications


There are a lot of MaxLinear, Inc. XRT75L00DIV-F Telecom applications.

  • T1/E1/J1 add/drop multiplexers (MUX)
  • CSU/DSU E1 Interface
  • Microwave transmission systems
  • CSU/DSU Equipment
  • Stations
  • E2 Rates PCM Line Interface
  • LAN Routers
  • Voice over packet gateways
  • Switching Systems
  • Wireless base stations

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