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XRT75L02IV-F

XRT75L02IV-F

XRT75L02IV-F

MaxLinear, Inc.

Telecom device2 Circuits

SOT-23

XRT75L02IV-F Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 100-LQFP
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 2
Current - Supply 260mA
XRT75L02IV-F Product Details

XRT75L02IV-F Overview


A 100-LQFP package is used to reduce board space requirements.Packing is done according to the Tray method.Telecommunications equipment is mounted using Surface Mount.2 circuits are used in this telecom IC .When 3.135V~3.465V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.At -40°C~85°C, reliable performance can be achieved.An electric current of 260mA is supplied to telecom equipment .

XRT75L02IV-F Features


Available in the 100-LQFP package

XRT75L02IV-F Applications


There are a lot of MaxLinear, Inc. XRT75L02IV-F Telecom applications.

  • T1/E1/J1 LAN/WAN Routers
  • Multichannel DS1 Test Equipment
  • T3 channelized access concentrators
  • Intelligent PBX
  • ATM Switches
  • Cross Connects
  • CSU/DSU E1 Interface
  • Interfaces to E3
  • E1 Network Equipment
  • DECT (Digital European Cordless Telephone) Base Stations

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