XRT75L03DIV Overview

To save board space, the 128-LQFP Exposed Pad package is used.For telecommunications equipment packing, the Tray method is used.A Surface Mount-mount is used for mounting the telecom circuit.A 3 circuit is the heart of this telecom IC .3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.-40°C~85°C is a temperature setting that is reliable when telecom switching comes to performance.There is a supply current of 480mA for telecom equipment to operate on.

XRT75L03DIV Features

Available in the 128-LQFP Exposed Pad package

XRT75L03DIV Applications

There are a lot of MaxLinear, Inc. XRT75L03DIV Telecom applications.

• M13 MUX
• Dual battery supply voltage SLICs
• Fiber
• Network Multiplexing and Terminating Equipment
• Interfaces to SONET STS-1 Networks
• Fractional T1/E1/J1
• High speed data transmission line cards
• SDH Multiplexers
• ISDN NT1/TA
• Voice over IP/DSL