XRT75L03DIVTR-F Overview

Board space can be saved by using the 128-LQFP Exposed Pad package.For telecommunications equipment packing, the Tape & Reel (TR) method is used.A Surface Mount mounting type is used.Telecommunications equipment consists of 3 circuits.3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.A temperature setting of -40°C~85°C ensures reliable performance.480mA is the supply current.

XRT75L03DIVTR-F Features

Available in the 128-LQFP Exposed Pad package

XRT75L03DIVTR-F Applications

There are a lot of MaxLinear, Inc. XRT75L03DIVTR-F Telecom applications.

• Intelligent PBX
• Inverse Multiplexing for ATM (IMA) Wireless Base Stations
• Set-Top Box
• Multichannel DS1 Test Equipment
• ISDN Primary Rate Interface
• DECT (Digital European Cordless Telephone) Base
• Channel Banks
• PCM channel bank
• ISDN NT1/TA
• T3 channelized access concentrators