XRT75L03IV-F Overview

The 128-LQFP Exposed Pad package reduces the amount of space on a board.Packing is done according to the Tray method.There is a type Surface Mount mount for this telecom circuit.3 circuits are used in this telecom IC .When 3.135V~3.465V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.Using -40°C~85°C as the operating temperature can result in reliable performance.Telecom equipment operates wit h a supply current of 480mA.

XRT75L03IV-F Features

Available in the 128-LQFP Exposed Pad package

XRT75L03IV-F Applications

There are a lot of MaxLinear, Inc. XRT75L03IV-F Telecom applications.

• ISDN terminal adapter
• Digital Cross-connect Systems (DCS)
• NIU
• Wireless Local Loop
• Switching Systems
• T1/E1/J1 Performance Monitoring
• Codec function on telephone switch line cards
• PBX (Private Branch Exchange)
• DECT (Digital European Cordless Telephone) Base Stations
• PBXs channel bank