XRT75L06DIB Overview
A 217-BBGA package saves space on a board.Telecommunications equipment is packed according to Tray's method.Telecommunications equipment is mounted with type Surface Mount.This telecom IC is composed of 6 circuits.When 3.135V~3.465V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.Using -40°C~85°C as the operating temperature can result in reliable performance.
XRT75L06DIB Features
Available in the 217-BBGA package
XRT75L06DIB Applications
There are a lot of MaxLinear, Inc. XRT75L06DIB Telecom applications.
- Router
- Network Multiplexing and Terminating Equipment
- Residential Gateways
- DSLAMs
- T1/E1/J1 Performance Monitoring
- Digital Cross Connect Systems
- Channel Service Units (CSUs): T1/E1/J1
- CSU/DSU Equipment
- SONET/SDH terminal
- DECT (Digital European Cordless Telephone) Base
