XRT75L06DIB Overview

A 217-BBGA package saves space on a board.Telecommunications equipment is packed according to Tray's method.Telecommunications equipment is mounted with type Surface Mount.This telecom IC is composed of 6 circuits.When 3.135V~3.465V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.Using -40°C~85°C as the operating temperature can result in reliable performance.

XRT75L06DIB Features

Available in the 217-BBGA package

XRT75L06DIB Applications

There are a lot of MaxLinear, Inc. XRT75L06DIB Telecom applications.

• Router
• Network Multiplexing and Terminating Equipment
• Residential Gateways
• DSLAMs
• T1/E1/J1 Performance Monitoring
• Digital Cross Connect Systems
• Channel Service Units (CSUs): T1/E1/J1
• CSU/DSU Equipment
• SONET/SDH terminal
• DECT (Digital European Cordless Telephone) Base