XRT75R06DIB-F Overview
Saving board space is achieved with the 217-BBGA package.In order to pack telecommunications equipment, Tray is used.Mounting type Surface Mount is used.The telecom IC is composed of 6 circuits.Telecom circuit is possible to increase efficiency by providing 3.135V~3.465V with a higher voltage.At -40°C~85°C, reliable performance can be achieved.There is a supply current of 725mA for telecom equipment to operate on.
XRT75R06DIB-F Features
Available in the 217-BBGA package
XRT75R06DIB-F Applications
There are a lot of MaxLinear, Inc. XRT75R06DIB-F Telecom applications.
- Fiber in the loop (FITL)
- Digital cross connects (DSX-1)
- SONET/SDH terminal
- SDH/SONET multiplexers
- Router
- ISDN Primary Rate Interfaces (PRA)
- E2 Rates PCM Line Interface
- Digital Cross Connect Systems
- Fiber In The Loop (FITL)
- Multi-Line E1 Interface Cards
