XRT75R06DIB-F Overview

Saving board space is achieved with the 217-BBGA package.In order to pack telecommunications equipment, Tray is used.Mounting type Surface Mount is used.The telecom IC is composed of 6 circuits.Telecom circuit is possible to increase efficiency by providing 3.135V~3.465V with a higher voltage.At -40°C~85°C, reliable performance can be achieved.There is a supply current of 725mA for telecom equipment to operate on.

XRT75R06DIB-F Features

Available in the 217-BBGA package

XRT75R06DIB-F Applications

There are a lot of MaxLinear, Inc. XRT75R06DIB-F Telecom applications.

• Fiber in the loop (FITL)
• Digital cross connects (DSX-1)
• SONET/SDH terminal
• SDH/SONET multiplexers
• Router
• ISDN Primary Rate Interfaces (PRA)
• E2 Rates PCM Line Interface
• Digital Cross Connect Systems
• Fiber In The Loop (FITL)
• Multi-Line E1 Interface Cards