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XRT75R06IB

XRT75R06IB

XRT75R06IB

MaxLinear, Inc.

Telecom device6 Circuits

SOT-23

XRT75R06IB Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mounting Type Surface Mount
Package / Case 217-BBGA
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 6
XRT75R06IB Product Details

XRT75R06IB Overview


Board space can be saved by using the 217-BBGA package.Telecommunications equipment is packed in the Tray-way.Telecommunications equipment is mounted with type Surface Mount.6 circuits are used in this telecom IC .When the voltage for 3.135V~3.465V is provided, improved efficiency can be achieved.A -40°C~85°C-temperature setting offers reliable performance.

XRT75R06IB Features


Available in the 217-BBGA package

XRT75R06IB Applications


There are a lot of MaxLinear, Inc. XRT75R06IB Telecom applications.

  • Channel Banks
  • T3 channelized access concentrators
  • Wireless base stations
  • E3/DS3 Access Equipment
  • Fractional T1/E1/J1
  • Wireless local loop (WLL)
  • PBX (Private Branch Exchange)
  • T1/E1/J1 Multiplexer and Channel Banks
  • Remote wireless modules
  • SDH/SONET multiplexers

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