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XRT75R06IB-F

XRT75R06IB-F

XRT75R06IB-F

MaxLinear, Inc.

Telecom device6 Circuits

SOT-23

XRT75R06IB-F Datasheet PDF

non-compliant

Technical Specifications

Parameter NameValue
TypeParameter
Mounting Type Surface Mount
Package / Case 217-BBGA
Operating Temperature-40°C~85°C
PackagingTray
Part StatusObsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 6
Current - Supply 725mA
In-Stock:2065 items

XRT75R06IB-F Product Details

XRT75R06IB-F Overview


Space is saved on the board by using the 217-BBGA package.Telecommunications equipment is packed using the Tray method.A Surface Mount-mount is used for mounting the telecom circuit.6 circuits make up this telecom IC .Improved efficiency can be ensured when the supply voltage of 3.135V~3.465V is provided.Operating temperatures of -40°C~85°C can ensure reliable performance.A 725mA supply current is required to operate telecom equipment .

XRT75R06IB-F Features


Available in the 217-BBGA package

XRT75R06IB-F Applications


There are a lot of MaxLinear, Inc. XRT75R06IB-F Telecom applications.

  • Central office
  • Cable PC
  • Routers
  • T3 channelized access concentrators
  • SDH Multiplexers
  • ISDN Primary Rate Interface
  • Channel Banks
  • High speed data transmission line cards
  • Wireless base stations
  • High-Density T1/E1/J1 interfaces for Multiplexers

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