XRT83VSH28ES Overview

A 225-BGA package is used to reduce board space requirements.A Bulk-packing method is used to pack telecommunications equipment.Surface Mount is used as telecommunications equipment mounting type.There are 8 circuits in this telecom IC .Telecom circuit is possible to increase efficiency by providing 3.14V~3.47V with a higher voltage.

XRT83VSH28ES Features

Available in the 225-BGA package

XRT83VSH28ES Applications

There are a lot of MaxLinear, Inc. XRT83VSH28ES Telecom applications.

• Home Side Box
• ATM Switches
• Channel Service Units (CSUs): T1/E1/J1
• T1 Digital Cross Connects (DSX-1)
• High-Density T1/E1/J1 interfaces for Multiplexers
• Digital access cross connects
• Switching Systems
• Hybrid fiber coax (HFC)
• Inverse Multiplexing for ATM (IMA)
• E2 Rates PCM Line Interface