XRT86VX38IB329-F Overview

The 329-FBGA package reduces the amount of space on a board.Telecommunications equipment is packed using the Tray method.Mounting type Surface Mount is used.An 8-circuit makes up this telecom IC .The voltage supplied to 3.3V can improve efficiency.A temperature setting of -40°C~85°C ensures reliable performance.

XRT86VX38IB329-F Features

Available in the 329-FBGA package

XRT86VX38IB329-F Applications

There are a lot of MaxLinear, Inc. XRT86VX38IB329-F Telecom applications.

• E3/DS3 Access Equipment
• Private branch exchange (PBX)
• Integrated Multi-Service Access Platforms (IMAPs)
• ISDN terminal adapter
• ISDN Primary Rate Interfaces (PRA)
• E1 Rates PCM Line Interface
• SDH/SONET multiplexers
• Integrated Access Devices
• Fiber In The Loop (FITL)
• E1 Multiplexer