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MLX80050KDC-CAA-000-RE

MLX80050KDC-CAA-000-RE

MLX80050KDC-CAA-000-RE

Melexis Technologies NV

8 Terminations Receivers1 Functions

SOT-23

MLX80050KDC-CAA-000-RE Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 20 Weeks
Mounting Type Surface Mount
Package / Case 8-SOIC (0.154, 3.90mm Width)
Surface Mount YES
Operating Temperature -40°C~125°C
Packaging Tape & Reel (TR)
Published 2016
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Type Transceiver
Terminal Finish Matte Tin (Sn)
HTS Code 8542.39.00.01
Voltage - Supply 5V~27V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1
Terminal Pitch 1.27mm
[email protected] Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code R-PDSO-G8
Protocol LINbus
Receiver Hysteresis 200mV
Height Seated (Max) 1.72mm
Length 4.89mm
Width 3.9mm
RoHS Status RoHS Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
3,000 $0.53354 $1.60062
MLX80050KDC-CAA-000-RE Product Details

MLX80050KDC-CAA-000-RE Overview


This driver chip is excellent for driving common LEDs due to its enhanced 8-SOIC (0.154, 3.90mm Width) package.The Tape & Reel (TR) package houses this receiver.As a Transceiver can transceiver, this part has enabled many applications to be served.On any Surface Mount-type PCB or development board, this wide receiver can be placed.A differential driver like this uses 5V~27V of power.IC receiver has been designed primarily for applications operating at -40°C~125°C.In order to drive and receive signals from data, this wide receiver has 8 terminations integrated.

MLX80050KDC-CAA-000-RE Features


Tape & Reel (TR) package

MLX80050KDC-CAA-000-RE Applications


There are a lot of Melexis Technologies NV MLX80050KDC-CAA-000-RE Drivers/Receivers/Transceivers applications.

  • TV signal transmission
  • Aircraft positioning
  • Fiber optic cable connection network
  • Precision engineering measurement
  • Ethernet circuitry
  • WDM transmission
  • Fiber distributed data interface (FDDI)
  • Wireless teaching
  • Bridges
  • Laser diode bonding

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