ARM7TDMI Microprocessor SIAP™ Series AT75C220 256-LFBGA
SOT-23
AT75C220-C256 Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Package / Case
256-LFBGA
Mounting Type
Surface Mount
Supplier Device Package
256-BGA (15x15)
Package
Tray
Base Product Number
AT75C220
Mfr
Microchip Technology
Product Status
Obsolete
Packaging
Tray
Series
SIAP™
Published
2001
Operating Temperature
--
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Base Part Number
AT75C220
Speed
40MHz
Core Processor
ARM7TDMI
Voltage - I/O
3.3V
Ethernet
10/100Mbps (2)
Number of Cores/Bus Width
1 Core 32-Bit
Graphics Acceleration
No
RAM Controllers
SDRAM
USB
--
Additional Interfaces
SPI, USART
Co-Processors/DSP
Signal Processing; OakDSP
Security Features
--
Display & Interface Controllers
--
SATA
--
RoHS Status
Non-RoHS Compliant
AT75C220-C256 Product Details
AT75C220-C256 Overview
The embedded microprocessor has been packed in 256-LFBGA for convenient overseas shipping. Using advanced packaging techniques Tray, high reliability is ensured. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. Understand how the operating temperature around -- is determined. This is a member of the SIAP™ series. With a core count of ARM7TDMI, this CPU is multicore. A CPU with this architecture uses SDRAM RAM controllers. With its SPI, USART interfaces, this microprocessor will be able to serve you better. The CPU runs at 3.3V when it comes to I/O. Use AT75C220 when searching for variants of the embedded microprocessor. Suppliers are offering 256-BGA (15x15) packages.
AT75C220-C256 Features
ARM7TDMI Core
AT75C220-C256 Applications
There are a lot of Microchip Technology AT75C220-C256 Microprocessor applications.