LE79114KVC

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Manufacturer part number:LE79114KVC

Manufacturer:Microchip Technology

Description:Telecom device1 Circuits

Case Package:SOT-23

Datasheet:LE79114KVC Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	10 Weeks
Lifecycle Status	IN PRODUCTION (Last Updated: 1 month ago)
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	128-TQFP
Supplier Device Package	128-TQFP
Packaging	Tray
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Voltage - Supply	3.3V
Interface	PCM
Number of Circuits	1
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
1	$24.350240	$24.35024
10	$22.971925	$229.71925
100	$21.671627	$2167.1627
500	$20.444931	$10222.4655
1000	$19.287671	$19287.671

LE79114KVC Overview

Saving board space is achieved with the 128-TQFP package.For telecommunications equipment packing, the Tray method is used.The mounting type is Surface Mount.Telecom circuit is made up of 1 circuits.When the voltage for 3.3V is provided, improved efficiency can be achieved.Mounted in Surface Mount-direction.