LE79124KVC Overview

A 128-TQFP package is used to reduce board space requirements.The way of Tray is employed for telecommunications equipment packing.Telecommunications equipment is mounted with type Surface Mount.

LE79124KVC Features

Available in the 128-TQFP package

LE79124KVC Applications

There are a lot of Microchip Technology LE79124KVC Telecom applications.

• Interfaces to E3
• Dual battery supply voltage SLICs
• ISDN Primary Rate Interface
• Fiber in the loop (FITL)
• ISDN Primary Rate Interfaces (PRA)
• E2 Rates PCM Line Interface
• Cable Telephony
• E1 Network Equipment
• ATM equipment with integrated DS1 interfaces
• Interfaces to SONET STS-1 Networks