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LE87220KQC

LE87220KQC

LE87220KQC

Microchip Technology

24 Terminations3.3V 24 Pin Telecom device2 Bits 2 Circuits

SOT-23

LE87220KQC Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 24-VQFN Exposed Pad
Number of Pins 24
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 24
ECCN Code EAR99
Technology BIPOLAR
Terminal Position QUAD
Terminal Form NO LEAD
Supply Voltage 3.3V
Terminal Pitch 0.8mm
Function Driver
Qualification Status Not Qualified
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.465V
Number of Circuits 2
Differential Output YES
Input Characteristics DIFFERENTIAL
Driver Number of Bits 2
Interface Standard GENERAL PURPOSE
High Level Input Current-Max 0.0001A
Height Seated (Max) 1mm
Length 6mm
Width 6mm
RoHS Status ROHS3 Compliant
LE87220KQC Product Details

LE87220KQC Overview


Saving board space is achieved with the 24-VQFN Exposed Pad package.Telecommunications equipment is packed using the Tray method.Telecommunications equipment is mounted using Surface Mount.2 circuits make up this telecom IC .A -40°C~85°C-temperature setting offers reliable performance.In Surface Mount's direction, telecom switching is mounted.In telecom switching configuration, 24 terminations are present.The voltage it operates at is 3.3V.24 pins are located on this telecom interface.The supply voltage is 3.3V, which provides designers with a lot of flexibility.

LE87220KQC Features


Available in the 24-VQFN Exposed Pad package
Operating supply voltage of 3.3V

LE87220KQC Applications


There are a lot of Microchip Technology LE87220KQC Telecom applications.

  • Wireless local loop (WLL)
  • Voice over IP/DSL
  • Cable modem
  • Multiplexers
  • T1/E1/J1 Multiplexer and Channel Banks
  • Integrated Multi-Service Access Platforms (IMAPs)
  • ISDN Primary Rate Interfaces (PRA)
  • PBX interfaces
  • Router
  • ATM equipment with integrated DS1 interfaces

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