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LE87501NQC

LE87501NQC

LE87501NQC

Microchip Technology

16 Terminations16 Pin Receivers2/0 Drivers/Receivers1 Functions

SOT-23

LE87501NQC Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case QFN
Number of Pins 16
Supplier Device Package 16-QFN (4x4)
Packaging Tray
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 16
Type Driver
Terminal Position QUAD
Terminal Form NO LEAD
Number of Functions 1
Supply Voltage 12V
Terminal Pitch 0.65mm
Reach Compliance Code unknown
Operating Temperature (Max) 85°C
Temperature Grade OTHER
Number of Drivers/Receivers 2/0
Height Seated (Max) 1mm
Length 4mm
Width 4mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
980 $0.77250 $757.05
LE87501NQC Product Details

LE87501NQC Overview


This LED driver IC features an enhanced QFN package for driving common LEDs.The Tray package contains this receiver.Since this part is a Driver can transceiver, a number of solutions have been able to utiliDrivere it for various purposes.PCB or development board with Surface Mount-type connectors can accommodate this wide receiver.It is possible to have up to 2/0 receivers/drivers in use simultaneously with this electronic part.12V is the supply voltage range that this line driver ic can efficiently operate with.In this wide receiver, 16 terminations are integrated for driving and receiving signals from data.A 16-pin driver IC with enhanced power dissipation control is featured here.A combination of optical transceiver downsizing and high-density Surface Mount mounting reduces the package size dramatically.There is a 16-QFN (4x4) supplier package included with wide receiver.This transceiver module may not exceed its operating temperature of 85°C.

LE87501NQC Features


Tray package
16 pins

LE87501NQC Applications


There are a lot of Microchip Technology LE87501NQC Drivers/Receivers/Transceivers applications.

  • Copper connection network
  • Wireless interactive experience
  • Wireless showroom
  • Gigabit Ethernet
  • SONET/SDH Network
  • Carrier phase observations
  • Satellite communications networks
  • Precision engineering measurement
  • Vehicle
  • Structural bonding

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