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LE88231DLC

LE88231DLC

LE88231DLC

Microchip Technology

Telecom device2 Circuits

SOT-23

LE88231DLC Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 14 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 80-LQFP
Packaging Tray
Published 2005
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Function Telecom Circuit
Interface PCM
Number of Circuits 2
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $7.632080 $7.63208
10 $7.200075 $72.00075
100 $6.792524 $679.2524
500 $6.408042 $3204.021
1000 $6.045322 $6045.322
LE88231DLC Product Details

LE88231DLC Overview


Saving board space is achieved with the 80-LQFP package.Telecommunications equipment is packed according to Tray's method.A Surface Mount-mount is used for mounting the telecom circuit.An 2-circuit makes up this telecom IC .A Surface Mount-axis mounts telecom switching.

LE88231DLC Features


Available in the 80-LQFP package

LE88231DLC Applications


There are a lot of Microchip Technology LE88231DLC Telecom applications.

  • E1 Multiplexer
  • Cross Connects
  • Multi-Line E1 Interface Cards
  • Voice over IP/DSL
  • T1/E1/J1 LAN/WAN Routers
  • Interfaces to DS3
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • Channel Banks
  • E1 Network Equipment
  • Dual battery supply voltage SLICs

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