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LE88276DLC

LE88276DLC

LE88276DLC

Microchip Technology

80 Pin Telecom device2 CircuitsMin 4.75V VMax 35V V

SOT-23

LE88276DLC Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 10 Weeks
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Contact Plating Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 80-LQFP
Number of Pins 80
Supplier Device Package 80-eLQFP
Weight 639.990485mg
Packaging Tray
Published 2008
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Voltage - Supply 4.75V~35V
Function Telecom Circuit
Number of Channels 2
Interface PCM
Number of Circuits 2
Max Supply Voltage 35V
Min Supply Voltage 4.75V
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
180 $4.86678 $876.0204
LE88276DLC Product Details

LE88276DLC Overview


To save board space, the 80-LQFP package is used.For telecommunications equipment packing, the Tray method is used.Surface Mount is used as telecommunications equipment mounting type.This telecom IC is composed of 2 circuits.Wtelecom IC's efficiencyh a high supply voltage, 4.75V~35V can be operated more efficiently.The mounting is in the way of Surface Mount.The telecom interface contains 80 pins.At least 4.75V voltage should be supplied.35V should be lower than the voltage supplied.Using 2 channels, it achieves its superior flexibility.

LE88276DLC Features


Available in the 80-LQFP package

LE88276DLC Applications


There are a lot of Microchip Technology LE88276DLC Telecom applications.

  • NIU
  • T1/E1/J1 add/drop multiplexers (MUX)
  • Digital access cross connects
  • Intelligent PBX
  • DECT (Digital European Cordless Telephone) Base Stations
  • E1 LAN/WAN Routers
  • ATM Switches
  • Inverse Multiplexing for ATM (IMA)
  • Interfaces to SONET STS-1 Networks
  • T1/E1/J1 Performance Monitoring

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