MCP2542FD-H/SN

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Manufacturer part number:MCP2542FD-H/SN

Manufacturer:Microchip Technology

Description:8 Terminations Receivers1/1 Drivers/Receivers1 Functions

Case Package:SOT-23

Datasheet:MCP2542FD-H/SN Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	16 Weeks
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	8-SOIC (0.154, 3.90mm Width)
Operating Temperature	-40°C~150°C
Packaging	Tube
JESD-609 Code	e3
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	8
Type	Transceiver
Terminal Finish	Matte Tin (Sn) - annealed
HTS Code	8542.39.00.01
Voltage - Supply	4.5V~5.5V
Terminal Position	DUAL
Terminal Form	GULL WING
Peak Reflow Temperature (Cel)	260
Number of Functions	1
Supply Voltage	5V
Terminal Pitch	1.27mm
[email protected] Reflow Temperature-Max (s)	30
JESD-30 Code	R-PDSO-G8
Data Rate	8Mbps
Protocol	CANbus
Number of Drivers/Receivers	1/1
Screening Level	AEC-Q100; TS 16949
Receiver Hysteresis	200mV
Height Seated (Max)	1.75mm
Length	4.9mm
Width	3.9mm
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
1	$0.81000	$0.81
25	$0.68000	$17
100	$0.61800	$61.8

MCP2542FD-H/SN Overview

Driver ICs with enhanced 8-SOIC (0.154, 3.90mm Width) packages are excellent for driving LEDs with common characteristics.In this package, the receiver is mounted in the Tube format.Being a Transceiver can transceiver, this part has empowered many solutions to serve for a variety of applications.Any Surface Mount-type PCB or development board can be used with this wide receiver.Power supply requirements for this differential driver are 4.5V~5.5V.This electronic part can have?up to 1/1 eligible receivers/drivers on the field at once.?In most applications, this ic receiver is used in environments where -40°C~150°C is the operating temperature.5V is the supply voltage range that this line driver ic can efficiently operate with.In this wide receiver, 8 terminations are integrated for driving and receiving signals from data.Through optical transceiver downsizing and high-density Surface Mount mounting technologies, its package size is reduced dramatically.