MCP2544FD-E/SN

join

new-10%

Manufacturer part number:MCP2544FD-E/SN

Manufacturer:Microchip Technology

Description:8 Terminations Receivers1/1 Drivers/Receivers1 Functions

Case Package:SOT-23

Datasheet:MCP2544FD-E/SN Datasheet

RoHs Status:non-compliant

Name	Value
Type	Parameter
Factory Lead Time	7 Weeks
Mount	Surface Mount
Mounting Type	Surface Mount
Package / Case	8-SOIC (0.154, 3.90mm Width)
Operating Temperature	-40°C~125°C
Packaging	Tube
JESD-609 Code	e3
Part Status	Active
Moisture Sensitivity Level (MSL)	3 (168 Hours)
Number of Terminations	8
Type	Transceiver
Terminal Finish	Matte Tin (Sn) - annealed
HTS Code	8542.39.00.01
Voltage - Supply	4.5V~5.5V
Terminal Position	DUAL
Terminal Form	GULL WING
Peak Reflow Temperature (Cel)	260
Number of Functions	1
Supply Voltage	5V
Terminal Pitch	1.27mm
[email protected] Reflow Temperature-Max (s)	40
JESD-30 Code	R-PDSO-G8
Data Rate	8Mbps
Protocol	CANbus
Number of Drivers/Receivers	1/1
Screening Level	TS 16949
Receiver Hysteresis	200mV
Height Seated (Max)	1.75mm
Length	4.9mm
Width	3.9mm
RoHS Status	ROHS3 Compliant

Quantity	Unit Price	Ext. Price
1	$0.79000	$0.79
25	$0.65920	$16.48
100	$0.60770	$60.77

MCP2544FD-E/SN Overview

Due to the enhanced 8-SOIC (0.154, 3.90mm Width) package, this driver IC is excellent for driving common LEDs.Tube package is used to mount this receiver.The Transceiver can transceiver technology has enabled this part to power many solutions for a variety of uses.This wide receiver can be placed on any Surface Mount-type PCB or development board.In terms of power supply, this differential driver utilizes 4.5V~5.5V.This electronic part can have?up to 1/1 eligible receivers/drivers on the field at once.?IC receiver likes this one are designed for use in applications where operating temperatures are -40°C~125°C.5V is the supply voltage range that this line driver ic can efficiently operate with.Wide receiver has 8 terminations built in for driving or receiving signals from data.This package size decreases dramatically due to optical transceiver downsizing and high-density Surface Mount mounting technologies.