MCP47FEB01A3-E/ST Overview

There are two packages that contain it: 8-TSSOP (0.173, 4.40mm Width) package and X package. An attachment Surface Mount allows the FPGA module to be attached to the development board. When operating the machine, it is important to keep the temperature within -40°C~125°C range. There is an FPGA model contained in Tube in order to conserve space. In total, it has 8 terminations on each end. In order to find related parts, use the part number MCP47FEB01 as a base.

MCP47FEB01A3-E/ST Features

8-TSSOP (0.173, 4.40mm Width) package

MCP47FEB01A3-E/ST Applications

There are a lot of Microchip Technology
MCP47FEB01A3-E/ST Digital to Analog Converters (DAC) applications.

• Digital Potentiometer
• Software Radio
• Wireless infrastructure:
• WCDMA, CDMA2000, TD-SCDMA, WiMAX
• Wideband communications:
• LMDS/MMDS, point-to-point
• Instrumentation:
• RF signal generators, arbitrary waveform generators
• Mobile Communications
• Process Control and Industrial Automation