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MCP47FVB02A3-E/ST

MCP47FVB02A3-E/ST

MCP47FVB02A3-E/ST

Microchip Technology

DACVoltage - BufferedSurface Mount R-2R R3mm mm

SOT-23

MCP47FVB02A3-E/ST Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 8-TSSOP (0.173, 4.40mm Width)
Surface Mount YES
Operating Temperature -40°C~125°C
Packaging Tube
Published 2016
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish Matte Tin (Sn)
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Terminal Pitch 0.65mm
[email protected] Reflow Temperature-Max (s) 40
Base Part Number MCP47FVB02
Output Type Voltage - Buffered
Number of Bits 8
Architecture R-2R
Converter Type D/A CONVERTER
Reference Type External, Internal, Supply
Data Interface I2C
Differential Output No
Voltage - Supply, Analog 2.7V~5.5V
Voltage - Supply, Digital 2.7V~5.5V
Settling Time 6μs (Typ)
Linearity Error-Max (EL) 0.1953%
Input Bit Code BINARY
INL/DNL (LSB) ±0.1, ±0.0125
Input Format SERIAL
Number of D/A Converters 2
Analog Output Voltage-Max 5.46V
Analog Output Voltage-Min 0.01V
Length 4.4mm
Width 3mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
400 $0.90640 $362.56
MCP47FVB02A3-E/ST Product Details

MCP47FVB02A3-E/ST Overview


It is supplied in the 8-TSSOP (0.173, 4.40mm Width) package. The Surface Mount-slot connector on the FPGA module can be connected to the development board. In order to ensure a safe and efficient operation, it is important to maintain a temperature within -40°C~125°C at all times. Unlike other FPGA models, this one is contained in Tube for the sake of space saving. 8 terminations are present in total. In order to find related parts, use the part number MCP47FVB02 as a base.

MCP47FVB02A3-E/ST Features


8-TSSOP (0.173, 4.40mm Width) package

MCP47FVB02A3-E/ST Applications


There are a lot of Microchip Technology MCP47FVB02A3-E/ST Digital to Analog Converters (DAC)?applications.

  • Automated Test Equipment
  • Video Encoder
  • Automatic Test Equipment
  • Waveform Reconstruction
  • Wireless infrastructure:
  • Low Cost I/O
  • Software Radio
  • Wideband communications:
  • Gain and offset adjustment
  • Digital Potentiometer

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