DAC Voltage - Buffered Surface Mount R-2R R 3mm mm
SOT-23
MCP47FVB12A2T-E/ST Datasheet
non-compliant
In-Stock: 0 items
Specifications
Name
Value
Type
Parameter
Factory Lead Time
6 Weeks
Mounting Type
Surface Mount
Package / Case
8-TSSOP (0.173, 4.40mm Width)
Surface Mount
YES
Operating Temperature
-40°C~125°C
Packaging
Tape & Reel (TR)
Published
2016
JESD-609 Code
e3
Part Status
Active
Moisture Sensitivity Level (MSL)
1 (Unlimited)
Number of Terminations
8
Terminal Finish
Matte Tin (Sn)
Terminal Position
DUAL
Terminal Form
GULL WING
Peak Reflow Temperature (Cel)
260
Number of Functions
1
Terminal Pitch
0.65mm
Time@Peak Reflow Temperature-Max (s)
40
Base Part Number
MCP47FVB12
JESD-30 Code
R-PDSO-G8
Output Type
Voltage - Buffered
Number of Bits
10
Architecture
R-2R
Converter Type
D/A CONVERTER
Reference Type
External, Internal, Supply
Data Interface
I2C
Differential Output
No
Voltage - Supply, Analog
2.7V~5.5V
Voltage - Supply, Digital
2.7V~5.5V
Settling Time
6μs (Typ)
Linearity Error-Max (EL)
0.1465%
Input Bit Code
BINARY
INL/DNL (LSB)
±0.4, ±0.05
Input Format
SERIAL
Number of D/A Converters
2
Analog Output Voltage-Max
5.46V
Analog Output Voltage-Min
0.01V
Length
4.4mm
Width
3mm
RoHS Status
ROHS3 Compliant
Pricing & Ordering
Quantity
Unit Price
Ext. Price
2,500
$1.19481
$2.38962
MCP47FVB12A2T-E/ST Product Details
MCP47FVB12A2T-E/ST Overview
A 8-TSSOP (0.173, 4.40mm Width) package contains it, and it is available for download. The Surface Mount-slot connector on the FPGA module can be connected to the development board. Operating temperatures should be maintained within the -40°C~125°C range at all times when the unit is in use. A model of this FPGA is contained in Tape & Reel (TR) for the purpose of saving space. In total, there are a total of 8 terminations on it. For related parts, use its base part number MCP47FVB12.
MCP47FVB12A2T-E/ST Features
8-TSSOP (0.173, 4.40mm Width) package
MCP47FVB12A2T-E/ST Applications
There are a lot of Microchip Technology MCP47FVB12A2T-E/ST Digital to Analog Converters (DAC) applications.
Software Radio
Wireless infrastructure:
WCDMA, CDMA2000, TD-SCDMA, WiMAX
Wideband communications:
LMDS/MMDS, point-to-point
Instrumentation:
RF signal generators, arbitrary waveform generators