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MCP47FVB21A0T-E/ST

MCP47FVB21A0T-E/ST

MCP47FVB21A0T-E/ST

Microchip Technology

DAC Voltage - Buffered Surface Mount R-2R R 3mm mm

SOT-23

MCP47FVB21A0T-E/ST Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 8-TSSOP (0.173, 4.40mm Width)
Surface Mount YES
Operating Temperature -40°C~125°C
Packaging Tape & Reel (TR)
Published 2016
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish Matte Tin (Sn)
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCP47FVB21
JESD-30 Code R-PDSO-G8
Output Type Voltage - Buffered
Number of Bits 12
Architecture R-2R
Converter Type D/A CONVERTER
Reference Type External, Internal, Supply
Data Interface I2C
Differential Output No
Voltage - Supply, Analog 2.7V~5.5V
Voltage - Supply, Digital 2.7V~5.5V
Settling Time 6μs (Typ)
Input Bit Code BINARY
INL/DNL (LSB) ±1.5, ±0.2
Input Format SERIAL
Number of D/A Converters 1
Analog Output Voltage-Max 5.46V
Length 4.4mm
Width 3mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
2,500 $1.01970 $2.0394
MCP47FVB21A0T-E/ST Product Details

MCP47FVB21A0T-E/ST Overview


In the package 8-TSSOP (0.173, 4.40mm Width), this product is provided. By attaching the Surface Mount connector, you can use this FPGA module with your development board. It is necessary to keep the operating temperature within -40°C~125°C when the device is operating. As a result of space limitations, this FPGA model has been included in Tape & Reel (TR). In total, the terminations of this piece are 8. MCP47FVB21 is the base part number that can be used to identify related parts.

MCP47FVB21A0T-E/ST Features


8-TSSOP (0.173, 4.40mm Width) package


MCP47FVB21A0T-E/ST Applications


There are a lot of Microchip Technology
MCP47FVB21A0T-E/ST Digital to Analog Converters (DAC) applications.


  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:
  • LMDS/MMDS, point-to-point
  • Instrumentation:
  • RF signal generators, arbitrary waveform generators
  • Mobile Communications
  • Process Control and Industrial Automation
  • Automatic Test Equipment
  • Portable Equipment

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