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MCP47FVB22A2-E/ST

MCP47FVB22A2-E/ST

MCP47FVB22A2-E/ST

Microchip Technology

DAC Voltage - Buffered Surface Mount R-2R R 3mm mm

SOT-23

MCP47FVB22A2-E/ST Datasheet

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Specifications
Name Value
Type Parameter
Factory Lead Time 6 Weeks
Mounting Type Surface Mount
Package / Case 8-TSSOP (0.173, 4.40mm Width)
Surface Mount YES
Operating Temperature -40°C~125°C
Packaging Tube
Published 2016
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 8
Terminal Finish Matte Tin (Sn)
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Terminal Pitch 0.65mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCP47FVB22
JESD-30 Code R-PDSO-G8
Output Type Voltage - Buffered
Number of Bits 12
Architecture R-2R
Converter Type D/A CONVERTER
Reference Type External, Internal, Supply
Data Interface I2C
Differential Output No
Voltage - Supply, Analog 2.7V~5.5V
Voltage - Supply, Digital 2.7V~5.5V
Settling Time 6μs (Typ)
Linearity Error-Max (EL) 0.1465%
Input Bit Code BINARY
INL/DNL (LSB) ±1.5, ±0.2
Input Format SERIAL
Number of D/A Converters 2
Analog Output Voltage-Max 5.46V
Analog Output Voltage-Min 0.01V
Length 4.4mm
Width 3mm
RoHS Status ROHS3 Compliant
Pricing & Ordering
Quantity Unit Price Ext. Price
300 $1.76130 $528.39
MCP47FVB22A2-E/ST Product Details

MCP47FVB22A2-E/ST Overview


There is a 8-TSSOP (0.173, 4.40mm Width) package that includes this component. The Surface Mount-slot on the development board allows you to attach the FPGA module. While operating, the operating temperature should be kept within a range of -40°C~125°C. As a space-saving measure, this FPGA model is contained within Tube. Total terminations are 8. In order to find related parts, you can use its base part number MCP47FVB22.

MCP47FVB22A2-E/ST Features


8-TSSOP (0.173, 4.40mm Width) package


MCP47FVB22A2-E/ST Applications


There are a lot of Microchip Technology
MCP47FVB22A2-E/ST Digital to Analog Converters (DAC) applications.


  • Display Electronics
  • Data Acquisition Systems
  • Calibration
  • Motor Control
  • Data Distribution System
  • Digital Potentiometer
  • Software Radio
  • Wireless infrastructure:
  • WCDMA, CDMA2000, TD-SCDMA, WiMAX
  • Wideband communications:

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