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MIC2310-1ZTS

MIC2310-1ZTS

MIC2310-1ZTS

Microchip Technology

Tube Active 1 Surface Mount Hot Swap Controllers 10mA mA 24-TSSOP (0.173, 4.40mm Width) 1 General Purpose Hot Swap Controller

SOT-23

MIC2310-1ZTS Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 24-TSSOP (0.173, 4.40mm Width)
Surface Mount YES
Number of Pins 24
Supplier Device Package 24-TSSOP
Number of Terminals 24
Supplier Package TSSOP
Mounting Surface Mount
Package Tube
Base Product Number MIC2310
Mfr Microchip Technology
Product Status Active
Package Shape RECTANGULAR
Manufacturer Microchip Technology Inc
Operating Temperature 0°C~70°C
Packaging Tube
Series --
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
ECCN Code EAR99
Type Hot Swap Controller
Terminal Finish MATTE TIN
Max Operating Temperature 70°C
Min Operating Temperature 0°C
Applications General Purpose
HTS Code 8542.39.00.01
Voltage - Supply 10.8V~13.2V
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1
Terminal Pitch 0.65 mm
Reach Compliance Code compliant
Base Part Number MIC2310
Pin Count 24
JESD-30 Code R-PDSO-G24
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 13.2 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 10.8 V
Number of Channels 1
Max Supply Voltage 13.2V
Analog IC - Other Type POWER SUPPLY SUPPORT CIRCUIT
Operating Supply Current 10mA
Current - Output (Max) --
Max Supply Current 10mA
Adjustable Threshold YES
Current - Supply 10mA
Seated Height-Max 1.2 mm
Internal Switch(s) No
Screening Level Commercial
Programmable Features Auto Retry, Circuit Breaker, Current Limit, Fault Timeout, Latched Fault, OVP, Slew Rate, UVLO
Feature Pins CPRIMARY, CRETRYM, CSLEW, DISCH, ENABLE, HW_FLT, (I_FLT, /I_FLT), OVP, (PWRGD, /PWRGD), S0, S1, SOURCE, UVLO, VISS, VREG
Features --
Width 4.4 mm
Length 7.8 mm
RoHS Status ROHS3 Compliant
Lead Free Lead Free
Pricing & Ordering
Quantity Unit Price Ext. Price
1 $4.05000 $4.05
25 $3.36800 $84.2
100 $3.06940 $306.94
MIC2310-1ZTS Product Details

MIC2310-1ZTS Overview


There is a 24-TSSOP (0.173, 4.40mm Width) package that includes this.At the moment, there are 1 channels available.The package resembles a Tube.There is a DUAL terminal position on the device.A total of 24 pins are present on it.This is set up in the same way as Surface Mount.Hot-swappable device is classified as a Hot Swap Controller electrical component.A temperature setting of 0°C~70°C will ensure reliable operation.General Purpose applications can be downloaded from the device.Hot-swappable device should be able to work wHot-swappable deviceh a 10.8V~13.2VV power source.Numbers in the MIC2310 family include it.This device uses 24 pins for operation.Among its programmable features are Auto Retry, Circuit Breaker, Current Limit, Fault Timeout, Latched Fault, OVP, Slew Rate, UVLO.There is currently an adequate supply of 10mA.Surface Mount directs its position.Operating at 70°C°C allows for stable operation.Maintaining reliability requires a minimum working temperature of 0°C degrees Celsius.For normal operation, Vsup should be maintained above 10.8 V.In the Vsup (maximum supply voltage) setting, 13.2 V is selected.Analog IC POWER SUPPLY SUPPORT CIRCUIT is used in this gadget.Hot Swap is capable of handling a maximum supply voltage of 13.2VV.There is a maximum output of --V from the device.In this case, 10mA is the operative supply current.In order for it to operate, a current of 10mA is required.A -- series electrical component is used in this application.

MIC2310-1ZTS Features


The terminal position of 24
Programmable features of Auto Retry, Circuit Breaker, Current Limit, Fault Timeout, Latched Fault, OVP, Slew Rate, UVLO
-- series


MIC2310-1ZTS Applications


There are a lot of Microchip Technology
MIC2310-1ZTS hot swap controllers applications.


  • Datacom
  • Electric vehicle
  • Avionics systems
  • Safe board insertion and extraction
  • Industrial computers and servers
  • Redundant-array-of-independent-disk (RAID) storage
  • Other forms of communications infrastructure
  • Board or blade insertion into live backplanes
  • Backplane
  • Loads

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