MIC2310-2ZTS-TR Overview

In the 24-TSSOP (0.173, 4.40mm Width) package you will find it.Channel 1 is currently available.A Tape & Reel (TR)-shaped package holds it.Device DUAL is located at the terminal position.The device consists of a total of 24 pins.As Surface Mount would say, it's set up like that.The electrical component in question falls into the classification Hot Swap Controller.A reliable operation requires the temperature to be set to 0°C~70°C.Apps for General Purpose are available on the device.Using a 10.8V~13.2VV power source should be able to power the device.The MIC2310 family includes it.During operation, 24 pins are used.Hot-swappable device has Auto Retry, Circuit Breaker, Current Limit, Fault Timeout, Latched Fault, OVP, Slew Rate, UVLO programmable features.Presently, there is a sufficient supply of 10mA.As you can see, it is positioned in the direction of Surface Mount.For stable operation, the maximum operating temperature should be 70°C°C.At a minimum working temperature of 0°C degrees Celsius, it maintains its reliability.Hot-swappable device is recommended to keep the supply voltage (Vsup) above 10.8 V so that the device can function normally.Vsup is set to 13.2 V, the maximum supply voltage.As you can see in this example, the gadget uses an analog IC called POWER SUPPLY SUPPORT CIRCUIT.An input voltage of 13.2VV is the maximum it can handle.Device --V has a maximum output.Hot Swap is 10mA which is the operative supply current.There is a maximum current requirement of 10mA for it to operate.There is an electrical component in this series called --.

MIC2310-2ZTS-TR Features

The terminal position of 24
Programmable features of Auto Retry, Circuit Breaker, Current Limit, Fault Timeout, Latched Fault, OVP, Slew Rate, UVLO
-- series

MIC2310-2ZTS-TR Applications

There are a lot of Microchip Technology
MIC2310-2ZTS-TR hot swap controllers applications.

• Safe board insertion and extraction
• Industrial computers and servers
• Redundant-array-of-independent-disk (RAID) storage
• Other forms of communications infrastructure
• Board or blade insertion into live backplanes
• Backplane
• Loads
• Distributed power systems
• Redundant negative voltage supplies
• Central office switching systems