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PL130-05QC-R

PL130-05QC-R

PL130-05QC-R

Microchip Technology

1 Circuit 1GHz 1:1 Clock Buffer QUAD PL130 16-WFQFN Exposed Pad

SOT-23

PL130-05QC-R Datasheet

non-compliant

In-Stock: 0 items
Specifications
Name Value
Type Parameter
Factory Lead Time 6 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 16-WFQFN Exposed Pad
Operating Temperature 0°C~70°C
Packaging Tape & Reel (TR)
Published 2012
Part Status Obsolete
Moisture Sensitivity Level (MSL) 2 (1 Year)
Number of Terminations 16
Type Buffer/Driver
Packing Method TR
Voltage - Supply 2.5V~3.3V
Terminal Position QUAD
Terminal Form NO LEAD
Number of Functions 1
Terminal Pitch 0.5mm
Base Part Number PL130
Output PECL
Supply Voltage-Max (Vsup) 3.3V
Supply Voltage-Min (Vsup) 2.5V
Number of Circuits 1
Frequency (Max) 1GHz
Input CMOS, LVDS, Sine Wave, TTL
Ratio - Input:Output 1:1
Differential - Input:Output No/Yes
Height Seated (Max) 0.8mm
Length 3mm
Width 3mm
RoHS Status ROHS3 Compliant
PL130-05QC-R Product Details

PL130-05QC-R Overview


There is a case of 16-WFQFN Exposed Pad in which it is packaged. A Tape & Reel (TR) is used to package it. In normal operation, the maximum value is set to 1GHz. There are 16 terminations in it. It's?set?up?in?the?way?of?Surface Mount. There is a classification of Buffer/Driver for this electronic part. Temperature 0°C~70°C is recommended for reliable performance. The clock switch should operate with a voltage of 2.5V~3.3VV. As a result, it is placed in the way of Surface Mount. As a result, it produces PECL. As a member of the PL130 family, it falls under that category. This is set to 3.3V for the maximum supply voltage. For normal operation, the supply voltage (Vsup) should be kept above 2.5V. It is based on the TR packing method.

PL130-05QC-R Features


16 terminations
The operating temperature of 0°C~70°C degrees

PL130-05QC-R Applications


There are a lot of Microchip Technology PL130-05QC-R Clock Buffers & Drivers applications.

  • Global positioning system (GPS)
  • Backplane
  • Cell Phone (UMTS/WCDMA/GSM)
  • Cloud computing
  • Other PCIe Gen2 networking applications
  • Tlecom applications
  • Gigabit Ethernet (GbE)
  • Data center
  • Big data
  • DDR4 JEDEC standard RDIMM design

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